ǥ ϶. 18 9 24 2.4% 34100 ŷǰ ִ.
18 Ǿ迡 14 3б ǥߴ. 336 15.7% ߴ. 567000 28.8%, 478000 95.3% þ.
ǰ ι ־ ߴ. ū 3D SPI System(Solder Paste Inspection, ˻) 11% 225, 3D AOI(Automated Optical Inspection, ǰ˻) 57% þ 983000 ߴ. PCB(Printed Circuit Board, μȸα) ǰ ƴ ˻ϴ .
Ǹŷ þ ȴ. 3б 3D SPI System 144 13% ߴ. (Ⱓ ġ) 3б 90.2% 3б 100% Ѿ 101.1% ߴ. ݵü ھü 귮 ÷ İ ó δ. ֱ к Z SK̴н ݵü 귮 ø鼭 İ ó þ. Ҿ 븸 ȭ 귮 밡 ȣ .
ϸ鼭 ũ þ . 15.7% ѵ 8.7% ϴµ ƴ. ݺ з 3б 129 9.1% ϴ ƴ. ϶߱ ̴. 3б Ժ 66.8% ū MAIN FRAME( ) 171 11% ϶ߴ. CAMERA/LENS(ī/, Ժ 10.1%) 19% 105, MOTOR(, Ժ 6.4%) 155000 18% ϶ߴ. PC(ǻ) ƴ.
Ÿܼ ũ ̴. Ÿ –17 24600 196000 ߴ. ȯ þ ̴. 3б (ڻ-ä) ū ȭ ̱ ȭ ȯ 325(66%, ü ) ϰ ִ. 3б / ⸻ȯ 1055.8 б 4.2% ߴ.
3б ݿ ְ(PER) 25.8. ְڻ(PBR) 4.38, ڱںͷ(ROE) 17.0%.
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