2002 , 2008 ڽڽ忡 ƴ. 2008 '2õ ž' 2010 3õ, 2011 5õ ž ߴ. 2010 ѱŷҿ ' èǾ' ر 5ȸ ' èǾ' ȸ.
ֿ ǰδ 3D SPI(Solder Paste Inspection, ˻) 3D AOI(Automated Optical Inspection, ǰ˻) ִ. 3D SPI PCB(Printed Circuit Board, μȸα) ¸ ˻ ҷ ҽŰ . 50% ̻ ϰ ִ. 3D AOI PCB ǰ ƴ ˻ϴ . 3 AOI ʷ ߴ.
2009 ϰ ߴ . Ҵ 2008 Ϲݱ ħü ̴. 2009 21.6% 269̾. ̵ 2010 ű ŷó Ȯ ݵü κ 164.5% 712 ߴ.
2009 AOI Ͽ 2010ʹ AOI ߰ƴ. AOI 2012 117 255% þ. 2D AOI 3D ü䰡 δ. 2013 AOI 224 ߰ 2014 1б 152 ÷ȴ. ߵ 48% Ŀ.
ݸ Ͱ ݿ ϰ ִ. 2010 2013 712 1039 45% ݸ 188 178 5.3% پ, 158 139 12% ߴ.
Ⱓ 297 487 64% ߴ. 2014 1б 55.7% ϴ ū (Main Frame) Ⱓ 33% ߰, PC( 11.6%) 9% ö.
ǰ þ. 2010 227 2013 374 65% ߴ. Ư ΰǺ(++Ļ) 88%(62) þ.
1б 79% ̴. 7Ⱓ 85% ̻ ߴ. ݸ ī Ϻ ǰ κ Ѵ. ̿ ȯ ȯ Ѵ. ȯ ϶ Ǹϴ ǰ ȭ ȯ ϶Ѵ. ȯ 2012 1137 1б 1069 5.1% ϶ߴ. Ⱓ SPI 6%, AOI 39% ȴ.
1б ڻ 353, ȭ ä 12 ϰ ִ. / 10% ϶ 35 ȭ ս Ѵ.
2014 1б ä 28%, 446% 繫 . 2009 ä 10 μǺλä ̴. 2008 о Ʈ ֿ ߺ ̴. μ 2012 ִ .
ROE 16.8% 2011 ϶ ̴. м Ʈ , 5Ⱓ ڻȸ 0.9 ~ 1.0, 繫 1.24 ~ 1.37踦 ߴ. ̿ ͷ ϶ ROE ݿƴ. ͷ 2010 22.9% 2013 13.3% .
5 2 24950 Ű ִ. 8 24200 Ű ŷ ̴. 1б ǥ̻縦 Ư 18.6%, ѱڹڻ( ѱ) ܼ ڸ 19.7% ϰ ִ(ѱ 6 26 ). ѱ ǥ̻纸 ִִ ǥ̻. ڽ ڰ ڸ ϴ ֽ ִ ֽļ Ѵ(ڽڽ 2 12).
ѱ 6° ϰ ִ. 2008 11 7 6.65% ߴٰ ó űԺ ߴ. ְ Ⱦϰų ϶ϸ ߰ż, ϸ Ϻθŵ ϸ ÷Դ. ѱ 1б 10ݵ ڻ뺸 尡ġַ зߴ. 3D SPI 1 ° Բ 3D AOI 2D AOI ü ô.
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