ѹ̹ݵü ܱκ .
9 Ǿ迡 ܱ ֱ ް ѹ̹ݵü ֽ 837966ָ żߴ. ̴ Ⱓ ü ŷ 9.5% Ը. ̷ν ܱ 6.7% 11.7% 5%P ö. ִ 50% ̻ ϸ Ȯ.
ġ Ը ڰ Ϻ ݿ δ. ѹ̹ݵü 17 ¶ ü â ݵ塯 ī̷ũťƮ, ݵ κ 440( 17.3%) Ը ڸ ġߴ. 䰡 ü ڱ 70%, ī̷ũťƮ 15% Ű ߴ.
ܱ ѹ̹ݵü ǰ ȿ ɼ ŷ ָ Ǯ̵ȴ. ѹ̹ݵü غ ǰ øĨ(Flip Chip-Bonder) Ǹϱ ߴ. øĨ ݵü () ԡ ڸ (bumping) ģ øĨ ܡи (lead frame) ϴ . PC ߾óġ(CPU), Ʈ ø̼ μ(AP) ݵü Ű¡ ȴ.
ǰ øĨ ϰ ִ. Ʈ Ŀ鼭 øĨ Ű¡ 䵵 ð ֱ ̴. ̴ Ŀ帮 ü ɷ Ȯ øĨ Ȯ ̾ ִ. ѹ̹ݵü 25 к 2б øĨ ǸŰ 1б 2 ̻ ߴٰ . 200 ̻ ϰ ִ.
KDB 4 17 ǰ ȿ ݿ ѹ̹ݵü 2б ũ ô. ǻ簡 2б 391, 72, ̴ 1б 46%, 232% Ը.
̷ ѹ̹ݵü ŷµ ϰ ִ. ȸ 2003 ر ߴ. Ư ִ 500, ð(7.4%) ߴ. ص ִ åѴٸ, ְ ͷ 4.3%. ֱ ⿹ ݸ 3% Ϸ ϶ϸ鼭 3% ̻ ͷ ŷ ް ִ.
S&P ַ İ ü...PER 11
ѹ̹ݵü ' ÷̽Ʈ'(S&P) ַ ݵü () ü. ü ( ) Ѵ. ǰ þ迡 ѹ̹ݵü S&P 70% ϰ ִ. S&P ״ 'ڸ'(Sawing), ڸ 'ġ'(Placement)ϴ 뵵. ѹ̹ݵü Ű Ǵ S&P ̸ַ, ַ 'ݵü Ĩ ũ Ű'(CSP: Chip Scale Package) .
ѹ̹ݵü 20 250 縦 Ȯϰ ִ. ̱ , 븸 ̿, Ŀũ ũ, STSݵü, ñ׳ƽ, н ǥ̴. ѹ̹ݵü ġ ڸ Ʈũ Ȱ ڡ ۷ι ݵü ü ŷ ̴. Ȯ ڱ ڿ Ȱ ȹ̴.
ѹ̹ݵü 1б 267 9% ߴ. 11% 274500 ߴ. ݸ ȸ ݿ ȯ Ÿܼ Ǹ鼭 133% þ 326300 ߴ.
ѹ̹ݵü ȭä ȭڻ . / ȯ ȯü ȴ. б⺸ ѹ̹ݵü / ȯ 5% 111400 ̷. 3 / ȯ 1113.5 б 3.9% ö. 1б ȯ 1133 б⺸ 1.6% ϶ߴ.
ֱ 4б ջ ݿ ѹ̹ݵü ְ(PER) 11. ְڻ(PBR) 1.7, ڱںͷ(ROE) 15.5%.
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