ؼ ݵü Ű¡ ʿ ݵü Substrate(, Package Substrate) Ǹϴ ȸ.
1б 65%. ֿ ǴϾ, STũ, NXP, ASE, Amkore, SPIL, STATS CHIPPAC, UTAC ̴. , Package Substrate 35%, Z, SK̴н ֿ ̴. ȸ 98%, 2% Ѵ.
ؼ ߴ. Բ Ͱ ͵ , ֱ Ǵ.
[1] Ʈ()
(ڷ: ġ)
۳ ͷ ͷ 24.4%, 19% ߴ. ͷ ߴµ, ͷ б ̴ ̴.
[2] ͷ Ʈ(ȯ)
(ڷ: ġ)
۳ 2б 84% ϶, ۳ 4б 68.4% . ǰ 7%븦 ߴ.
[3] &ǰ(ȯ)
(ڷ: ġ)
۳ ڻ 13.8% ߴ. 12~14%븦 ̴.
[4] ڻ (ȯ)
(ڷ: ġ)
2022 ڱںͷ(ROE) 35.6%, 5 ROE 17.1% . ROE 3б 38.3% ϶ȯ ؿ ̸.
15 ðѾױ ְڻ(PBR) 1.69. ̴ 5 1.87迡 ̴. PBR 2022 2б 2.85踦 ϶ Ѵ.
[5] ROE&PBR(ȯ)
(ڷ: ġ)
ROE 3 ǥ мϴ м Ʈ . ͷ 4б ̴ ̸ 18.9% ߴ. ڻȸ 3 б ϶ , 繫 2 б ϶ߴ.
[6] м(ȯ)
(ڷ: ġ)
ȸ簡 ִ ߴ. ִ ȭ ȭ ̴ 2020 450 2021 600 2022 900 ߴ. ۳ ð 2.5%.
[7] &ð()
(ڷ: ġ)
ä 47.5%, 189% ߴ. Ϲ 繫 ưư ä 100% , 100% ̻ δ. ̿ ؼ 繫 ŷ ũٰ ִ.
[8] ä (ȯ)
(ڷ: ġ)
Ա 2 б ϴ ̴. , Ա ߴµ, 11.5% ߴ.
[9] Աݰ Ա (ȯ)
(ڷ: ġ)
۳ ں 105踦 ߴ. ȸ簡 ں ִٴ Ȯ ִ.
[10] ں(ȯ)
(ڷ: ġ)
, ְ 2022 5 72400 ũ ϶ߴ. ٽ ݵߴٰ .
[11] ְ& (ȯ)
(ڷ: ġ)
ؼ 15 1б ǥߴ. ȸ 1б 1924 ߴ. ̴ ۳ Ⱓ 4% ġ. Ⱓ 36% 311 ÷ȴ.
ȣ "1) ȯ϶/ǰ, 2) 1б ͼ ߴ" ߴ.
װ ġ ϸ, "۷ι ȭ Һ ҿ ġ ߴ", "IT ȭ 2б ӵ ̴" мߴ.
ȣ ݵ 丮 ߴµ, "1) ڵ ݵü Ȯ, 2) ű Ȯ ҿ ", "() ǴϾ, STũθ ۷ι ݵü ü Ȯ밡 ̾ ִ" ߴ.
Ʈ ݵü 2023 2026 13% δ. ̿ ؼ ߴ.
VƮ мغ
ۼǾϴ. ۿ õ ϴٴ ݵ ּ. Ǵܿ å ο ֽϴ.
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