| 2100 88% ϴ 1850 ǻ翡 Ʈ Ұ 3 Դϴ. Ʈ ϳ ʴ 1500 ˴ϴ. ڴ ó ǻ翡 ٷ ʴ ĸ 췮 ǥ ٽƮ Ұմϴ.
ְ 8 2.08% 25850̴. 2021 2б ְ ݿ ְ(PER) 17, ְڻ(PBR) 2.7, ڱںͷ(ROE) 16%. ð ðѾ 8234̴. ڰ ֽMRI м ŷµ 25 15̴. Ȧκ ҵ ݵü PCB ü. ֿ ǰ ũ PCB ݵü Ű ʿ FBGA, FC-CSP, BOC Ű 꽺ƮƮ(Package Substrate) еȴ. 2021 ݱ PCB 23%, Ű 꽺ƮƮ 75%. ü 80% ̻ شѴ.
ȸ PCB FC-CSP, MCP, SiP, BOC 强 Package Substrate о߷ Ȯ Ȯ븦 ؿԴ. ǰ PC, , Ʈ ٺȭǾ ۷ι Big5 ĨĿ(Z, SK̴н,USA chipmaker, Űþ, ϵ) Big5 Ű¡ (ASE, Amkor, SPIL, JCET, PTI) Ȯߴ.
ؿ 2 ű ü ø ߾. ݾ 2 400, 8 305 Ը̰ 9, 12 ̴. ΰġ MSAP SIP 뿡 ؼ. ȸ MSAP ɷ 2022 1 45000 5 Ȯ ̴.
2018 Ϻ ȸ ̽ ȸ ߰ ̿ Ȯƾ. ٸ Ϻ ȸ ս ӵʿ ߰ 2019 ڸ ߴ. ۳ ڷγ Ŀ Ʈ ΰġ ǰ 20% ߴ. Դٰ Ϻ ȸ簡 ȯ ϸ鼭 ڷ Ƽ.
ص ΰġ ǰ ӵƴ. 2б б ִ ߴ. ȸ "ΰġ MSAP ǰ ݱ ġ ʰ ߴ"鼭 " Ϲݱ ΰġ MSAP ǰ 밡 ӵ Ϲݱ ġ 11%, 29% ߴ" ߴ. 13249(+10% ), 1152(+52%)̴.
ѱ 2Ⱓ Ű¡ ¿ ̾ غʹ ǰ ټ λ ƴ. ݵü ȮǼ Ű¡ ֹ ø ִ. ܰ 3б þ δ. 1 б(2~3) , ûϴ ǰ̴.
繫 ȣ ̴. 2021 2б ä 167%, 64% ߴ. ڸ Ե ڱ Ա ȯ 400% Ѵ ä ũ ϶ߴ. Ա 19.7% , ں 11.6迡 ں ִ.
2019 Ϻ ȸ ս ӵʿ ڸ ROE ̳ʽ(-) ߴ. ۳ Ͼ ROE 15% Ѿ. ROE ° Բ PBR ö. 2019 1 Ʒ PBR ֱ 3 ܿ ǰ ִ. Ⱓ ְ 뷫 5 ߴ.
ֱ ؿ ô οݰ ô. οݰ 6 ֽļ 1619041ַ 5.08%̶ ߴ. κ ϸ 8 ֽ 鿴 5% ѱ鼭 ǹ .
ռ οݰ ڿ 7 6% ̻ ߴٰ ִ. 2~3 ֽ Ⱦ 4% Ʒ ߱ ߴ. ÿ ְ ۳ 12 2 ѱ οݰ ȸ δ.
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