| 2100 88% ϴ 1850 ǻ翡 Ʈ Ұ 3 Դϴ. Ʈ ϳ ʴ 1500 ˴ϴ. ڴ ó ǻ翡 ٷ ʴ ĸ 췮 ǥ ٽƮ Ұմϴ.
ڰ ֽMRI м ŷµ 25 17̴.
ݵü PCB(μȸα) ü '15 Ȧκ ҵƴ. ǰ PC, , SSD ٺȭǾ Ĩ Ŀ Z, SK̴н Ű¡ ASE, Amkor Ȯϰ ִ.
۷ι(ھ), Ѱ(PCB ) ӻ ΰִ. Module PCB(*) 28.2%, Package Substrate 71% ̴.
* Module PCB 뷮 Ȯ ϳ PCB ݵüĨ е ǰ̸, Package Substrate Ϲ κʹ ݵü Ĩ ֵ Ƽ̼(Ʈ ý Ʈ) ϴµ ʿ ̴.
1 װ 300~800 ִ. '16 7920 12013 4Ⱓ 51% ߴ. '19 Ȳ ڸ ̵ ٷ ȸߴ.
20% þ 12013̴. 897, 565 ȯߴ. ڷγ ұ MSAP ΰġ ǰ Ϻ ȯ â ̷ ְ ߴٰ ߴ.
ص ̴. " PCB ӵǴ Ϲݱ PC DRAM DDR5 ȯ ϰ ۵ "̶ "5G ׳ Ǵ AIP PCB "̶ ߴ.
4б ä 171%, 57% ߴ. Ա 20.6%, ں 8.3迡 ں ִ.
ڱںͷ(ROE) '19 -22.5% ִ 鼭 19.7% ݵߴ. ְڻ(PBR) 2.45 2.54躸 . ִڻ αٿ ŷǴ ְ '19 Ϲݱ ִڻ ŷǰ ִ.
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