| 2100 88% ϴ 1850 ǻ翡 Ʈ Ұ 3 Դϴ. Ʈ ϳ ʴ 1500 ˴ϴ. ڴ ó ǻ翡 ٷ ʴ ĸ 췮 ǥ ٽƮ Ұմϴ.
̸Ż ְ 4 1.17% 12950̴. 2020 3б ְ ݿ ̸Ż ְ(PER) 18.1, ְڻ(PBR) 1.36, ڱںͷ(ROE) 7.5%. ð ðѾ 2942̴.
ڰ ֽMRI м ̸Ż ŷµ 25 15̴. ̸Ż ϴ ȸ̰, 繫¿ ͼ ?
̸Ż ݵü Ű¡ (Solder Ball) ü 2014 ȸ ȯϿ. ִ(Solder Ball) ݵü Ű CSP(Chip Scale Package) ǰ Ĩ ȣ Ѵ.
̸Ż CSP 2 ֿ Z, ũ, SK̴н ̴. 꿡 DS MYANMAR ӱ, 轺 뼺 ΰ ִ.
̸Ż 2016 ߴܿս ڸ 3Ⱓ ϸ ڸ ߴ. 2019 518 8% ߰ 251% 41, 7% پ 112 ߴ.
ֱ б 2020 3б 389 4% 403̴. Ⱓ 38 39 3% þ, 93 143 54% ߴ. Ű Ȳ Ұ, ǰ ִ ھִ(CSB), ũμִ(MSB) ǰ Ͽ. Ⱓ 轺 ϸ й 52% þ.
繫 ȣϴ. 2020 3б ä 5%, 914% ߴ. Ϲ ä 100% , 100% ̸̻ ϴٰ ǴѴ. Ա 0.9% ſ , ں 171.9迡 ں ִ.
̸Ż ڱںͷ(ROE) 4~8% ̿ ƴ. 2020 3б ROE 7.5% 2019 5.6% ߴ. ְڻ(PBR) 1.34 2019 0.86躸 ö. ְ ü ִڻ Ʒ ŷǴٰ ֱ ְ ϸ鼭 ŷǰ ִ.
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