ݵü õ dz Ұ ִ ݵü з Ǵ ŷ/ڽڿ , ϵ ѹ ˾ƺ ʿ䰡 ǴܵǾ ڷḦ øϴ.
ݵü ü ũ ϸ Ϲ İ еȴ. ٽ - ݵü Ǵ - ݵü ȭǰ , 丮Ŭ, 輱 - еǸ,
İ - , ̾, - ִ.
ٽ
İ ˻ - Test Handler, Chip Mounter, Burn-in System
ش ..
1) / ġ ټ ̰ .. 2) 100 ̸ ܽ 3) ݵü / lcd ߺǴ κе . ü (04) ݵü ǹ 4) , , , 04 ̸ ǹ |
< ݵü ü >
< ݵü ü>
< >
ȭб(CVD : Chemical Vapor Deposition)
ȭб̶ ݵü ȿ ȭбü Ͽ ȭй ȭչ ۿ Ű ϸ Ǵ Ǵ Ư ȭб Ѵ.
ũ װ зǴµ ȭб (AP CVD : Atmospheric Pressure CVD), ȭб(LP CVD : Low Pressure CVD), ȭ ö ȭ (PE-CVD) ִ
İ(Etchants) (Cleaning Chemicals)
İ ݵü ǵ÷ ϰ Ǵ ̴. 켱 İ ̶ ǥ̳ ǵ÷ ǿ ݵü ȸθ Űų ʿ Ͽ ȭоǰ Ư ȭй ̿Ͽ ϴ ۾ İ ̶ ϸ ̷ Ǵ ǰ̳ Ư ŸḦ İ Ѵ.
̶ ۳ ǵ÷ ǥ鿡 ݵü ̳ ų ݼӿ̳ ڵ ϱ Ŀ ǰ Ͽ Žִ ۾ ̶ ϸ ݵü 30 40% ߿伺 ϴ ִ.
丶ũ
ǿ ȸθ ȭ ȸε
䷹Ʈ(P/R)
ȸθ ϱ
Ĩ ܺȸο
Etching (İ)
Silicon Wafer ʿ κи ܳ ʿ κ ȭ Ǵ 쿩 ۰
Bonding
ַ Wire Bonding̶ þ ݵü ǰ Chip PAD ܺ ڸ ϴ ۾
Chiller(ĥ)
ݵü ַ Etching(İ) Process Chamber µ ϴ µ
Asher()
ǽ İ̳ ̿ ǽ (Dry Strip) ݵü
Burn in System
µ(83~125) Device з Ͽ Ʈϴ ġ
Capillary
Wire Bonding ݼ ϴµ ϴ (Ball ְ, Wire ִµ
Cascade System
3 Ǿ ִ ν (DI Water) 帣鼭 ٴκ ǵ Ͽ Wafer ġ
Gold Wire
ݵü Die Package ڰ ϴ ݼ
Slurry Supply System
ݵü ϳ CMP Ͽ ǥ ʹ̼ źȭϴ ġ
TRAY
ݵü , ݵü LCD Moduleǰ( ǰ) ܺ ̳ , κ ϰ ȣ ֵ ۵ ǰ
Si, AI203, Quartz
ݵü κǰ
NF3
ݵü LCD Ư
C.C.S.S
ݵü LCD ʿ Chemical ݰϴ ڵȭ System̸, پ ǰ
WET SYSTEM
ݵü Cleaner LCD system, Glass Etching system Fab Etching ÿ Ǵ μ ַ Ϻ Ͽ, ֱ ȭ ߷ ü ǰ.
RF-Genertor
ݵü (Etch, CVD, ) Plasma ġ
Pellicle (縮Ŭ)
ݵüDevice Photolithography(뱤İ) Photomask(ݵüȸε) ̹κ ȣϱ Ǵ ǰ
GAS SCRUBBER
ݵü LCD 꼳 GAS Ͽ ϴ Air+Heating Condition , ¿ , 2 Powder Collector .
hedger ȸ縦 ǰ мϰ ,, ϴ.
ڽ ִ ƴ ϴ.
A3 ٰ ڴ µ.
̷ .
ڱ ġ .
ݱ ˰ ־µ ݵǴ Դϴ.
մϴ.
· ð Ű ¥ ּż մϴ.
..̹ ŬϽø ũ Ǽ ֽϴ..
, ѹ ϸ ؾ ϴ°̶ ʿ Դϴ.
մϴ.
ڷ۵˴ϴ..(ƴ°Ծ..)
ٵ̷DZϴ..
մϴ.^^