1987 е ݵü ſ PCB(Printed Circuit Board) ַ ϴ ̴. ֿ ǰδ Memory Module , Package Substrate , ֱٿ Build-Up ǵ ϰ ִ.
Memory Module ϳ PCB ټ Ĩ Ͽ ϳ ǥ ǰ PC DRAM, Flash Memory κ ȴ.
Package Substrate / ݵü üϿ PCB 鿡 ǥ ν ȣä ϴ BGA, CSP, Flip Chip پ ڴܼ ʰ Ű¡ ʼ ̴.
Build-Up PCB ϰ ִ ǰ ߿ ϳ MLB(Multi Layer Board) ʹ 帱 ̿Ͽ ̸ Ͽ ȸ ̴ ̴.
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Memory Module ǰ ũ ó Ͽ ݵü Ⱑ ȭ 2000 2002 Ը ڸ Ͽ. , Ȳ ӿ ߰ ڷ ο ó ߰ϴµ Ͽ. , Build-Up о߿ ϴ ǰ ٰȭ ϱų´. ̷ ݵü ȸ Package Substrate Ȯ ȯ Ͽ źź ͱ Ʋ ǰ ִ.
Memory Module 2000 85% ̻ ũп ߵǾ, 2001 Zڿ ̴н ƼϿ 5 Memory ݵü ŷϴ Memory Moduleü . Package Substrate ι STATS ܿ 2001 ASAT縦 ߰ ȮϿ. STATS簡 ChipPAC縦 μϿ ChipPAC ŷ ϰ Ǿ.
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Memory Module þü Ը ȿ ó ѱ ó ߽ Ǵ ȭ ǰ ִ. Memory Moduleǰ 並 ZⰡ ϰ , IBIDEN, SHINKO, CMK Ϻü ڱ ݵü ü ü ڰ Ȳ̸, UNIMICRON 븸ü ڱ ü 信 ϰ о߿ 븸ü Ը 鿡 ӵ ̴. Z, ̴н ü ƴ϶, ũ, ƼϿ ٿȭ Ȯϴ ȭ ֿü λϴ , Ȯ ȴ.
20% ̻ ؿ ݵü Ű¡ ڵ̳ CPU, Ĩ ַ äǾ Դ FBGA Package Substrate ̿ ʰ ڴܼ Ű¡ DDR2 , Flash Memory 忡 Ծ ݵü Ȯʿ ̸ ϴ Package Substrate ι ȴ.
ռ ߵ 2000 3Ⱓ ڸ . ݵü Ⱑ ұ ̴. ó ٺȭ ̻ ǰ Ʈ ϸ鼭 ũ Ű ο ̴. , PCB ü ڰ Package Substrate Ҵ. ڱԸ ̹ ̳ ۵Ǹ ڿ ºδ ̴.
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